Skip to content


Helsinki 19.-21.11.2019

EFECS 2019 – European Forum for Electronic Components and Systems

EFECS provides an opportunities to learn more about the latest developments, cooperation and funding possibilities in the Electronic Components and Systems industry.

Read more here

EFECS is the international forum with a focus on 'Our Digital Future' along the Electronic Components and Systems value chain in Europe. Business Finland's booth introduces the best Finnish know-how in Electronic Components and Systems.

Why attend?

  • Discover the latest technology trends and how digitalization will help your company to create future business models within industries like smart systems, automobile, telecom, mobile, energy and healthcare
  • Network with stakeholders and partners, and create your project consortia
  • Shape the Strategic Research Agenda through interactive workshops
  • Learn about calls and funding landscape developments. 

Finnish innovations available

Find the following innovative organizations at the Finland booth:

  • TactoTek (printed electronics and electronic components integrated into 3D injection molded structures)
  • Vaisala (weather, environmental and industrial measurement solutions)
  • Sisuproco (Silicon Surface Processing Commercialization, SISUPROCO project, by Materials Research Laboratory of University of Turku finds treatments for decreasing defects on silicon surface)
  • 6G Flagship (world's first 6G research program by the University of Oulu)
  • Bluefors (cryogen-free dilution refrigerator systems)
  • VTT
  • Flexbright

Come and see and try yourself!

The organisers of this event are AENEAS, ARTEMIS-IA, EPoSS, ECSEL Joint Undertaking, the European Commission, in association with EUREKA, and Business Finland.

Contact us

Ms. Veera Koskinen
veera.koskinen (at)
+358 50 4769 929